15 × 10 × 0.3 mm
15 × 10 × 0.3 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
RFID Tags · RFIDAK
HF RFID PCB Components
The archived HF PCB catalog lists seven rigid FR4 outlines, including Ø8 × 0.3 mm and 11.5 × 4.7 × 0.17 mm components. These are 13.56 MHz accessory components, distinct from the thicker UHF boards used on metal assets.
Updated September 24, 2026
- Substrate
- FR4 rigid circuit board
- Frequency
- 13.56 MHz
- Catalog chip families
- MIFARE Classic, Ultralight, DESFire, NTAG213 / 215 / 216 or FM11RF08
Technical reference
Product specifications
Model-specific data and source scope are shown together.
Archived component reference: numerical outlines are retained for comparison, not released as current production drawings.
Choose a reference
Models & configurations
Choose a model or format to include it in your quote or sample request.
13 × 8 × 0.3 mm
13 × 8 × 0.3 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
11.5 × 4.7 × 0.17 mm
11.5 × 4.7 × 0.17 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
Ø18 × 0.4 mm
Ø18 × 0.4 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
Ø15 × 0.3 mm
Ø15 × 0.3 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
Ø10 × 0.3 mm
Ø10 × 0.3 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
Ø8 × 0.3 mm
Ø8 × 0.3 mm
Archived outline; do not assume the thickness includes all chip protrusions. [1]
Appearance & construction
Photos & drawings
Open a picture to inspect the original file. Dimensions are taken from the cited references.
Application & selection
Before choosing this product
Rigid PCB versus FPC
FR4 provides a rigid antenna substrate, while an FPC uses flexible polyimide. Choose based on the final cavity, permitted bending and assembly process; the same chip family can be mounted in either type.
Molding exposure
A board material’s heat resistance does not establish that the bonded chip, antenna and encapsulation survive a molding cycle. Use the complete temperature, pressure and dwell profile for the assembled product.
Sources & documents
Technical references
Published specifications identify the reference model. They do not replace the final order drawing or a model-specific test report.
- Archived component catalog — physical references ↗
Catalog / drawing reference · reviewed 2026-09-20
Custom orders & samples
Request your configuration
Choose the reference, then add quantity, destination, chip or reader details and any artwork on the enquiry page.